ICNCRE 2013

International Conference on Nanoelectronics, Communications and Renewable Energy 2013

 


ICNCRE 2013 Kokula Krishna Hari K
Short Title ICNCRE 2013
Publisher ASDF, India
ISBN 13 978-81-925233-8-5
ISBN 10 81-925233-8-1
Language English
Type Hard Bound - Printed Book
Copyrights admin@asdf.res.in
Editor-in-Chief Mohamed Rachid Mekideche
Conference Dates 22 - 23, September 2013
Venue Country Jijel, Algeria
Submitted Papers 477
Acceptance Rate 21.17%
Website www.asdf.org.in

Paper 063


Deposition Conditions Effect on The Structural Properties of The Polycrystalline Silicon Films

Deposition Conditions Effect on The Structural Properties of The Polycrystalline Silicon Films

B. Birouk1, N. Doukhane2

1,2Jijel University.

Abstract

The objective of this work is to study and analyze the properties of the thin films of polysilicon heavily doped with boron, with phosphorus or not doped, deposited by low pressure chemical vapour deposition (LPCVD) from silane (SiH4) and doping gas (BCl3, PH3) on oxidized or not monosilicon substrate, of <111> or <100> orientation. One uses in the analysis of the structural properties of these deposits, the X-rays diffraction (XRD) and scanning electron microscopy (SEM).

The analysis by XRD shows the influence of the substrate orientation and doping level on the grains size of the films. From SEM images one can see the effect of deposit conditions like the temperature and the substrate nature which acts on the grains size and the crystallinity of deposited films, because the particle sizes decrease with the increase in Td because of the improvement of the high crystallinity of the films with Td.

Author's Profile

B. Birouk : Profile

N. Doukhane : Profile

Cite this Article as Follows

Birouk, B, and Doukhane, N.Proceedings of The International Conference on Nanoelectronics, Communications and Renewable Energy 2013. Deposition Conditions Effect on The Structural Properties of The Polycrystalline Silicon Films. Vol. 1. Chennai: Association of Scientists, Developers and Faculties, 2013. 309-313. Print.